Taiwan Manz Asia launches semiconductor cleaning stations

台灣萬潤（Manz Asia）推出半導體清洗設備站

TAIPEI (Taiwan News) – Manz Asia announced Tuesday that it has developed a one-stop processing station targeting advanced chip packaging, according to a Manz Asia press release.

The firm said the station focuses on a key wet process called electroplating. A glass panel is first etched with chemicals to remove unwanted layers and then treated with a thin metallic film, making it more resistant to scratches and rust.

The firm said the station then prepares the panel for chip-layer redistribution, which is the rearranging of a chip's connectors. This helps the chip perform better with improved conductivity, as more can be fitted inside packaging frames.

The firm noted that, besides supplying power management circuitry, radio frequency, and automotive markets, it now covers next-gen CoPoS and glass core through glass packaging solutions. The firm noted that by combining its etching and electroplating processes, it can make durable, conductive glass support frames of varying thickness.

Chip-on-Panel-on-Substrate differs from traditional round silicon wafers as it uses a large, rectangular glass panel. It is more cost-effective and can fit more chips for faster computing.

Manz CEO Lin Chun-sheng (林峻生) said semiconductor packaging has evolved from making chips smaller to fitting more in larger, modular frames with improved performance. He said the AI-driven less-is-more approach is what makes the firm's redistribution process competitive.