TSMC applies to build 1.4nm process fab in Taichung

台積電（TSMC）申請在台中興建1.4奈米製程晶圓廠

TAIPEI (Taiwan News) — Taiwan Semiconductor Manufacturing Co. has applied to build a next-generation 1.4nm chip fabrication plant in Taichung, marking another step forward in the company’s push for technological leadership, per CNA.

The chipmaker applied to the National Science and Technology Council’s Central Taiwan Science Park Bureau on Friday to begin construction of its A14 fab. The facility is expected to require an initial investment of around NT$1.5 trillion (US$49 billion), with mass production scheduled for the second half of 2028.

According to US technology website Wccftech, TSMC aims to break ground on the new fab by the end of this year. The company’s research and development for the 1.4nm process will be based in Hsinchu, where recruitment has already begun.

TSMC’s official website states that the 1.4nm process will deliver a 15% speed improvement over its 2nm technology, while reducing power consumption by 30% and increasing logic density by more than 20%.

TSMC Chairman and CEO C.C. Wei (魏哲家) said at an investor conference on Thursday that the company is developing multiple phases of its 2nm wafer fabs in Hsinchu and Kaohsiung Science Parks. He added that TSMC will continue to invest heavily in both advanced process and packaging facilities in Taiwan.

Wei emphasized that while TSMC expands overseas production, Taiwan remains the company’s core base for innovation and capacity. “TSMC will continue to be a trusted technology and a provider for the global semiconductor industry,” he said.