Semicon Network Summit strengthens Taiwan chip ties

晶鏈高峰論壇加強台灣晶片供應鏈

TAIPEI (Taiwan News) — The Semicon Network Summit in Taipei brought together government, industry, and academic leaders to forge international partnerships and secure semiconductor supply chains.

According to the Industrial Technology Research Institute, the meeting drew more than 600 participants from 28 countries, including the US, Japan, the UK, and France. Key figures included President Lai Ching-te (賴清德), National Science and Technology Council Minister Wu Cheng-wen (吳誠文), and Economics Minister Kung Ming-hsin (龔明鑫).

Lai highlighted Taiwan’s commitment to international cooperation and global investments. He unveiled plans for the Ten Major AI Infrastructure Projects, supporting research in quantum computing and robotics.

Lai awarded the Medal of Economic Contribution to Akira Amari, honorary chairman of Japan’s Semiconductor Strategy Promotion Parliamentarian Alliance, and TSMC Chair C.C. Wei (魏哲家). Amari was recognized for strengthening Japan–Taiwan semiconductor collaboration and Wei for advancing global chip technology and AI and automotive applications.

Kung stressed Taiwan’s global strategy, aiming to build partnerships and boost supply chain resilience. ITRI President Liu Wen-hsiung (劉文雄) noted the talent gap, urging the need for professionals with deep expertise and cross-disciplinary knowledge.

The summit featured four panels: a global dialogue on semiconductor networks, enhancing trusted cross-border supply chains, co-creating AI chip innovations through modular and open collaboration, and addressing talent shortages with scalable training programs. Speakers covered regional complementarity and collaborative approaches.

ITRI said that by bringing top leaders together, the summit reinforced Taiwan’s role as a reliable partner in global semiconductor supply chains.