TSMC to build four new fabs in Taichung

台積電（TSMC）將在台中新建四座晶圓廠

TAIPEI (Taiwan News) — TSMC is set to break ground on four new 1.4 nanometer chip fabs by the end of the year in Taichung’s Xitun District.

At Central Taiwan Science Park’s (CTSP) 22nd anniversary celebration on Sunday, Director-General Hsu Maw-shin (許茂新) announced that land for the second phase expansion has been handed over to TSMC, per Liberty Times. The company has leased the site and plans to begin construction on four fabs with a two-year buildout timeline.

The event drew more than 250 industry professionals, including executives and managers from over 100 major tech firms. With early-stage flood retention and water conservation projects underway at the Phase II site in Taichung, large construction contractors such as Dacin Construction were on site watching for updates on the groundbreaking schedule.

Hsu pointed out that with the global semiconductor boom driving stable growth at CTSP, park revenue for the year is expected to surpass NT$1.2 trillion (US$37 billion), setting a new record. He confirmed that public infrastructure work at the second phase site has begun.

TSMC revealed at its North America Technology Symposium in April that the new facility, designated Fab 25, will house four 1.4 nm fabs. The first fab is expected to complete risk assessment of wafer production by the end of 2027, with mass production of sub-2 nm chips scheduled for the second half of 2028.

Initial monthly output for the new fabs is projected at 50,000 wafers, using TSMC’s most advanced process technology. The expansion is expected to further solidify TSMC’s lead in next-generation chip manufacturing.

While TSMC Chair and CEO C.C. Wei (魏哲家) said around 30% of future 2 nm and beyond capacity will be in the US following the company’s NT$4.86 trillion global investment plan, supply chain insiders believe Taiwan will remain the production hub. They noted that TSMC already plans two 2 nm fabs in Baoshan and five more in Kaohsiung’s Nanzih District.