Taiwan’s National Tsing Hua University pioneers chip coating tech

台灣國立清華大學率先研發晶片塗層技術

Low-carbon laser cuts production time and energy cost with one step


TAIPEI (Taiwan News) — A research team at National Tsing Hua University has developed a coating laser that promises to reduce emissions and energy use in chipmaking.

Led by Professor Lee Ming-tsang (李明蒼) of the Department of Power Mechanical Engineering, the team’s innovation enables patterned coatings on curved surfaces in a single step, per CNA. The process reduces production time, lowers material costs, and decreases carbon emissions.

Lee explained that his previous research in the US on laser sintering – turning nanoparticles into 3D structures – required round-the-clock labor to prepare nanomaterials. “Now, this new technology can stack micron-scale metal structures in 3D – just like one-step 3D printing,” he added.

The team said it hopes to extend the platform to flexible electronics. This includes “electronics on skin” for medical applications and futuristic tech such as transparent displays and temperature-sensitive lenses.

Developed in collaboration with National Taiwan University and National Applied Research Laboratories, Lee said the technology has drawn interest from a major local semiconductor firm.

Doctoral student Huang Yu-hsun (黃毓勛) noted that while the system is not suited for mass production yet, it offers strong potential for customized, high-precision applications in advanced manufacturing.